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| Semiconductor SHE155PGI-(B) High Efficiency LED Lamp Features * * * * * * * * Green colored diffusion lens type Ellipse type(X=5.2mm, Y=3.8mm) Ultra luminosity Flangeless package High power LEDs Oval shape Lens Color : Green(Diffusion Type) Half Angle(2 1/2) : 110 / 40 ) Application * Full color displays * Message boards * Variable message signs(VMS) Outline Dimensions 5.20.2 3.80.2 unit : mm 7.00.2 3.80.5 0.5 22.0 Min. 1.0 Min. 2.54 Nom PIN Connections 1.Anode 2.Cathode KLE-3022-000 1 SHE155PGI-(B) Absolute maximum ratings Characteristic Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature 2 1 Symbol PD IF IFP VR Topr Tstg Ratings 120 40 50 4 -3085 -30100 260 for 5 seconds Unit mW mA mA V * Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms Recommend document -. LED is very sensitive to ESD. *2.Keep the distance more than 2.0mm from PCB to the bottom of LED package Electrical Characteristics Characteristic Forward Voltage * Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current *3Half Angle 4 Symbol VF IV Test Condition IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V Min. Typ. Max. 520 520 3.2 1170 525 35 55 20 2640 530 10 - Unit V mcd nm nm uA deg P IR 1/2 X Y IF= 20mA *3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity *4. Luminous Intensity Maximum tolerance for each Grade Classification limit is 18% *4. Luminous Intensity classification P 520~780 Q R S 780~1170 1170~1760 1760~2640 KLE-3022-000 2 SHE155PGI-(B) Characteristic Diagrams Fig. 1 IF - VF Forward Current IF [mA] Fig. 2 IV - IF Luminous Intensity Iv [mcd] Forward Voltage VF [V] Forward Current IF [mA] Fig. 3 IF - Ta Fig.4 Spectrum Distribution Current IF [mA] Forward Ambient Temperature Ta [] Relative Intensity [%] Wavelength [nm] Fig. 5-1 Radiation Diagram(X) Fig. 5-2 Radiation Diagram(Y) Relative Luminous Intensity Iv [%] Relative Luminous Intensity Iv [%] KLE-3022-000 3 1. ESD(Electro Static Discharge) : Chip Al2o3 (Sapphire: ) Chip Damage VF Down 2. ESD 2-1. ESD (Electro Static Discharge) : (+) (-) ( , , , ) (-) (+) (+) (-) . : , , , , , : , , , , : , . 2-2. -. . 80% . (10%~20%) (65%~90%) Table 6[KV] 0.1[KV] 7[KV] 0.6[KV] 20[KV] 1.2[KV] -. -. : Wrist Strap ( ), Heel Grounder, , , , -. Conveyer Table : Conductive Floor Mat ESD . KLE-3022-000 4 SHE155PGI-(B) These AUK products are intended for usage in general electronic equipments(Office and communication equipment, measuring equipment, domestic electrification, etc.). Please make sure that you consult with us before you use these AUK products in equipments which require high quality and/or reliability, and in equipments which could have major impact to the welfare of human life(atomic energy control, airplane, spaceship, traffic signal, combustion central, all types of safety device, etc.). AUK cannot accept liability to any damage which may occur in case these AUK products were used in the mentioned equipments without prior consultation with AUK. KLE-3022-000 5 |
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